Bergquist 2213719 Thermal Pad GAP PAD, S-Class, 0.020" Thickness, 3.543x0.787", TGP5000/5000S35 | EMINKH.COM

Thermal Interface
Bergquist 2213719 Thermal Pad GAP PAD, S-Class, 0.020" Thickness, 3.543x0.787", TGP5000/5000S35

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Bergquist 2213719 Thermal Pad GAP PAD, S-Class, 0.020" Thickness, 3.543x0.787", TGP5000/5000S35

Name: Bergquist 2213719 Thermal Pad GAP PAD, S-Class, 0.020" Thickness, 3.543x0.787", TGP5000/5000S35
Brand: Bergquist

Model2213719

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Size: 3.543 in x 0.787 in

Color: Light Green

Width: 89.9 mm

Length: 19.98 mm

Material: Silicone Polymer

Thickness: 0.508 mm

Unit Weight: 3.250 g

Designed for: VRMs, POLs, CDROM/DV ROM, PCB to Chassis, ASICs/DSPs, Memory Packages/Modules, Thermally Enhanced BGA's

Breakdown Voltage: 5 kVAC

Flammability Rating: UL 94 V-0

Thermal Conductivity: 5 W/m-K

Maximum Operating Temperature: + 200 C

Minimum Operating Temperature: - 60 C