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Type: Mobile SDRAM
Density: 512 Mbit
Package: 54TFBGA
Mounting: Surface Mount
MSL Level: MSL 3 - 168 hours
Pin Count: 54
Lead Finish: Tin-Silver-Copper
No. of Pins: 54
Organization: 32M x 16
Data Bus Width: 16 Bit
Memory Density: 512 Mbit
Number of Banks: 4
Screening Level: Industrial
Supplier Package: TFBGA
Address Bus Width: 13 Bit
Maximum Clock Rate: 133 MHz
Product Dimensions: 8 x 8 x 0.8 mm
Supply Voltage Nom: 2.5 V
Clock Frequency Max: 133 MHz
Max Processing Temp: 260 °C
Number of I/O Lines: 16 Bit
Operating Temperature: -40 to 85 °C
Number of Bits per Word: 16 Bit
Operating Supply Voltage: 3.3 V
Maximum Operating Current: 60 mA
Operating Temperature Max: 85 °C
Operating Temperature Min: -40 °C
Maximum Random Access Time: 6|8 ns
