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Package: 260BGA
Mounting: Surface Mount
MSL Level: MSL 4 - 72 hours
Pin Count: 260
Lead Finish: Tin-Silver-Copper
UTOPIA Level: No
Integrated CDR: No
Supplier Package: BGA
Maximum Data Rate: 1.25 Gbps
Product Dimensions: 19 x 19 x 2
Standard Supported: 10 Base-T|100 Base-TX|1000 Base-T
Max Processing Temp: 260
Overhead Octet Support: No
PHY Line Side Interface: Yes
Operating Supply Voltage: 1.2, 1 V
Number of Channels per Chip: 4
