Molex 5022250801 Conn Wire to Board Header 80 POS 2.5/3.5/3.7mm Solder RA Through Hole Tray

Type: Wire to Board

Pitch: 2.5|3.5|3.7 mm

Gender: Header

Mounting: Through Hole

Lead Finish: Tin Over Nickel

Series Name: 502225 Series

Housing Color: Black

Product Depth: 49 mm

Number of Rows: 4

Product Height: 30.6 mm

Product Length: 99 mm

Contact Plating: Tin Over Nickel

Body Orientation: Right Angle

Contact Material: Copper Alloy

Number of Contacts: 80 POS

Termination Method: Solder

Max Processing Temp: 260 °C

Base/Housing Material: PBT (Polybutylene Terephthalate)

Operating Temperature: -40 to 105 to 125 °C

Maximum Current Rating/Contact: 6 A