Get exclusive volume discounts, bulk pricing updates, and new product alerts delivered directly to your inbox.
By subscribing, you agree to our Terms of Service and Privacy Policy.
Direct access to our certified experts
- Ideal for inspecting BGAs, CSPs and other components for solder bridging, cold solder joints, missing solder balls and solder voids. Use as a stand-alone inspection system with composite video compatible monitor (not included) or in conjunction with the PACE TF or IR series BGA Area Array System to compare real-time images to a user built library for easy identification of process defects. Store images electronically too.
- Images can be viewed, stored and managed through software or viewed on a stand-alone monitor
- Real-time X-Ray images gives you immediate feedback
- CameraHigh resolution with 7-40 X Zoom
- Max PCB Size:760 mm x Unlimited (30" x unlimited)
- Focal Spot: 0.2mm (.008")
- Focal spot to image distance plane: 124mm (4.875")
- Adjustments:
+ Voltage (10 to 50kv),
+ Amperage,
+ Live or Capture Video signal,
+ Frame averaging up to 32000 frames, & Video Gain Adjustment
- Spatial Resolution: 20 lp/mmv
- Opening Clearance: 19mm (.75") 230 V System
