Santec TMS-2000 Wafer Thickness Mapping System (1 nm)
1. High Accuracy
High accuracy measurement using interferometric detection technique (1 nm repeatability)
2. Industry Standard Parameters
Analysis of Global (GFLR, GFLD, GBIR), Site (SFQR, SFQD, SBIR), Edge (ESFQR) possible
3. High Environmental Resistance
No temperature control or vibration countermeasures are required due to environmental durability
Small form factor suitable for multiple applications
4. Compact Size
Analysis Software
Thickness Measurement Site Analysis Edge Analysis
5. High Speed
Spiral Scanning (High speed, high density)
Note: Customers are advised to carefully read the Datasheet to select the correct ordering code that meets their usage requirements.
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