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Pitch: 0.5 mm (0.02 in)
Data Rate: 32 Gb/s
Application: Advanced Driver Assistance Systems, Artificial Intelligence, Embedded Computer, Server Storage
Stack Height: 12 mm
Current Rating: 500 mA
Mounting Angle: Straight
Mounting Style: SMD/SMT
Number of Rows: 2 Row
Voltage Rating: 100 V
Contact Plating: Gold
Contact Material: Copper Alloy
Housing Material: Liquid Crystal Polymer (LCP)
Termination Style: Solder
Flammability Rating: UL 94 V-0
Number of Positions: 40 Position
Insulation Resistance: 100 MOhms
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 55 C