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Chip: NXP UCODE 9
Chip Attachment Technology: Direct Chip Attach
EPC and User Memory: 96-bit and n/a
TID Memory: 96-bit
Die-Cut Dimension: 64 x 6 mm / 2.520 x 0.236 in
Inlay Substrate: 38um PET substrate
Face Sheet: -BW0053
Thickness of the IC: 120 µm
Standard Pitch: 25.4 mm / 1.0 in
Web Width: 70.36 mm / 2.770 in
Core Size: 76 mm / 3 in
Quantity / Reel: 5000 pcs/reel
Size of Roll: MAX OD: 8”
Operating Temperature: -40 °C to 85 °C / -40 °F to 185 °F
On-Metal: Non metal
