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CTS Electronic Components BDN11-3CB/A01 Heat Sink Passive BGA/PGA/PLCC/QFP Extruded PCB Mount 20.9°C/W Aluminum

Name: CTS Electronic Components BDN11-3CB/A01 Heat Sink Passive BGA/PGA/PLCC/QFP Extruded PCB Mount 20.9°C/W Aluminum
Brand: CTS Electronic Components

ManufacturerCTS Electronic Components(View more products from this manufacturer)

ModelBDN11-3CB/A01

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Type: Passive

Material: Aluminum

Mounting: PCB Mount

Fin Style: Extruded

Series Name: BND

Device Cooled: BGA|PGA|PLCC|QFP

Attachment Method: Adhesive Tape

Product Dimensions: 28.19 x 28.19 x 9.02 mm

Thermal Resistance: 20.9 °C/W