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Rated power: 8200W
Upper power: 1200W
Lower power: 1200W
IR preheating power: 5800W
Chip application: POP, CCGA,BGA,QFN and CSP etc.
Temperature profiles storage: 50000 groups
Chip feeding system: Automatic picking up and replacing
Optical CCD working mode: Front, back, left and right
PCB positioning: Up and down intelligent positioning,bottom "5-point support" with V-groove fixing PCB which can be adjusted freely in the X-axis direction, with universal fixtures
meanwhile
Chip mounting: Laser positioning and optical CCD locating
Temperature accuracy: ± 1 ℃
Alignment accuracy: 0.01mm
PCB size: Max 450×500 mm Min 10×10mm
Chip size: 1*1~100*100mm
Min spacing: 0.15mm
Min LED spacing: 0.1mm
External temperature ports: 4 pcs (optional)
Dimensions: L900×W850×H1750 mm
Weight: 200kg
