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Operational mode : Time delay integration (TDI)
Number of TDI stages : 128
TDI algorithm : Built-in
Pixel size : 50 µm
Pixel matrix : 8192 x 128
Active area : 410 mm x 6.4 mm
Maximum scanning speed : 1 m/s @ 50 µm pixel pitch
TDI line rate : 20 kHz
Energy range : ~20–200 kV
Mechanical dimensions (L x W x H) : ~450 mm x 160 mm x 50 mm
Weight : ~7 kg
Internal radiation shield : Yes, X-ray beam max width at detector: ≤10 mm for 205 mm model / ≤32 mm for 410 mm model
Lifetime under X-ray : 10 kGy
Collimator: Yes, internal shielding collimator
Interface : 10 Gb ENET over fiber (FSP+)
Data output : 12–16 bit in TDI mode
External trigger support : Yes, including A/B/Z encoder (Differential input)
Operational voltage : +24 V DC
Power consumption : < 200 W
Ingress protection rating : IP56
Temperature and humidity:
• Operational: 0 – +50 °C / 10 – 95 % (non-condensing)
• Storage: 0 – +40 °C / 10 – 95 % (non-condensing)
• Transport: -10 – +60 °C / 10 – 95 % (non-condensing)
Compliances : CE, UKCA, RoHS, China RoHS, WEEE, EMC: IEC61326-1
