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Test area:
High-temp. exposure range: +60 to +300°C
Low-temp. exposure range: -65 to 0°C
Hot chamber:
Temperature pull-down time: Within 60 minutes from ambient temperature to +300°C
Cold chamber:
Temperature pull-down time: Within 90 minutes from ambient temperature to -65°C
Temperature recovery performance:
Condition:
High temperature exposure: +300°C (30 minutes)
Low temperature exposure: -45°C (30 minutes)
Specimen: Plastic mold IC 1 kg
Temperature recovery time: Within 10 minutes
Test area dimensions (mm): W320×H148×D230
