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Density: 72 Mbit
Package: 209FBGA
Mounting: Surface Mount
Rad Hard: No
MSL Level: MSL 3 - 168 hours
Pin Count: 209
Lead Finish: Tin-Silver-Copper
No. of Pins: 209
Timing Type: Synchronous
Architecture: Flow-Through|Pipelined
Memory Density: 72 Mbit
Number of Ports: 8
Number of Words: 1 MWords
Screening Level: Commercial
Supplier Package: FBGA
Address Bus Width: 20 Bit
Product Dimensions: 22 x 14 x 1.1 mm
Supply Voltage Max: 3.6, 3.6 V
Supply Voltage Min: 3, 3 V
Supply Voltage Nom: 3.3, 3.3 V
Clock Frequency Max: 200 MHz
Max Processing Temp: 260
Number of I/O Lines: 72 Bit
Operating Temperature: 0 to 70 °C
Data Rate Architecture: SDR
Number of Bits per Word: 72 Bit
Maximum Operating Current: 285@Flow-Through|385@Pipelined mA
Operating Temperature Max: 70 °C
Operating Temperature Min: 0 °C
Maximum Random Access Time: 7.5@Flow-Through|3@Pipelined ns
Maximum Operating Supply Voltage: 2.7, 3.6 V
Minimum Operating Supply Voltage: 2.3, 3 V
Typical Operating Supply Voltage: 2.5, 3.3 V
