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Density: 9 Mbit
Package: 165FBGA
Mounting: Surface Mount
Rad Hard: No
MSL Level: MSL 3 - 168 hours
Pin Count: 165
Lead Finish: Tin-Silver-Copper
No. of Pins: 165
Timing Type: Synchronous
Architecture: Flow-Through|Pipelined
Memory Density: 9 Mbit
Number of Ports: 2
Number of Words: 512 kWords
Screening Level: Industrial
Supplier Package: FBGA
Address Bus Width: 18 Bit
Product Dimensions: 15 x 13 x 0.94 mm
Supply Voltage Max: 2.7, 2.7 V
Supply Voltage Min: 2.3, 2.3 V
Supply Voltage Nom: 2.5, 2.5 V
Clock Frequency Max: 150 MHz
Max Processing Temp: 260
Number of I/O Lines: 18 Bit
Operating Temperature: -40 to 85 °C
Data Rate Architecture: SDR
Number of Bits per Word: 18 Bit
Maximum Operating Current: 125@Flow-Through|135@Pipelined mA
Operating Temperature Max: 85 °C
Operating Temperature Min: -40 °C
Maximum Random Access Time: 7.5@Flow-Through|3.8@Pipelined ns
Maximum Operating Supply Voltage: 2, 2.7 V
Minimum Operating Supply Voltage: 1.7, 2.3 V
Typical Operating Supply Voltage: 1.8, 2.5 V
