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Density: 9 Mbit
Package: 165FBGA
Mounting: Surface Mount
Rad Hard: No
MSL Level: MSL 3 - 168 hours
Pin Count: 165
Lead Finish: Tin-Silver-Copper
No. of Pins: 165
Timing Type: Synchronous
Architecture: Flow-Through|Pipelined
Memory Density: 9 Mbit
Number of Ports: 4
Number of Words: 256 kWords
Screening Level: Commercial
Supplier Package: FBGA
Address Bus Width: 18 Bit
Product Dimensions: 15 x 13 x 0.94 mm
Supply Voltage Max: 3.6, 3.6 V
Supply Voltage Min: 3, 3 V
Supply Voltage Nom: 3.3, 3.3 V
Clock Frequency Max: 300 MHz
Max Processing Temp: 260
Number of I/O Lines: 36 Bit
Operating Temperature: 0 to 70 °C
Data Rate Architecture: SDR
Number of Bits per Word: 36 Bit
Maximum Operating Current: 165@Flow-Through|225@Pipelined mA
Operating Temperature Max: 70 °C
Operating Temperature Min: 0 °C
Maximum Random Access Time: 5@Flow-Through|2.5@Pipelined ns
Maximum Operating Supply Voltage: 2.7, 3.6 V
Minimum Operating Supply Voltage: 2.3, 3 V
Typical Operating Supply Voltage: 2.5, 3.3 V
