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Pitch: 0.4 mm (0.016 in)
Application: Board to Board, Board to FPC
Stack Height: 0.98 mm
Current Rating: 300 mA
Mounting Angle: Straight
Mounting Style: SMD/SMT
Number of Rows: 2 Row
Voltage Rating: 30 V
Contact Plating: Gold
Contact Material: Phosphor Bronze
Housing Material: Liquid Crystal Polymer (LCP)
Termination Style: Solder
Flammability Rating: UL 94 V-0
Number of Positions: 10 Position
Insulation Resistance: 50 MOhms
Maximum Operating Temperature: + 85 C
Minimum Operating Temperature: - 35 C
