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Type: Mobile SDRAM
Density: 64 Mbit
Package: 90TF-BGA
Mounting: Surface Mount
MSL Level: MSL 3 - 168 hours
Packaging: T/R
Pin Count: 90
Lead Finish: Tin-Silver-Copper
No. of Pins: 90
Organization: 2M x 32
Data Bus Width: 32 Bit
Memory Density: 64 Mbit
Number of Banks: 4
Screening Level: Industrial
Address Bus Width: 11 Bit
Maximum Clock Rate: 166 MHz
Product Dimensions: 8 x 13 x 0.8(Max)
Supply Voltage Nom: 3.3 V
Clock Frequency Max: 166 MHz
Max Processing Temp: 260 °C
Number of I/O Lines: 32 Bit
Operating Temperature: -40 to 85 °C
Number of Bits per Word: 32 Bit
Operating Supply Voltage: 3.3000 V
Maximum Operating Current: 55 mA
Operating Temperature Max: 85 °C
Operating Temperature Min: -40 °C
Maximum Random Access Time: 8|5.5 ns
