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Type: Mobile SDRAM
Density: 512 Mbit
Package: 90TF-BGA
Mounting: Surface Mount
MSL Level: MSL 3 - 168 hours
Pin Count: 90
Lead Finish: Tin-Silver-Copper
No. of Pins: 90
Organization: 16M x 32
Data Bus Width: 32 Bit
Memory Density: 512 Mbit
Number of Banks: 4
Screening Level: Industrial
Supplier Package: TFBGA
Address Bus Width: 13 Bit
Maximum Clock Rate: 133 MHz
Product Dimensions: 8 x 13 x 0.8 mm
Supply Voltage Nom: 1.8 V
Clock Frequency Max: 133 MHz
Max Processing Temp: 260 °C
Number of I/O Lines: 32 Bit
Operating Temperature: -40 to 85 °C
Number of Bits per Word: 32 Bit
Operating Supply Voltage: 1.8000 V
Maximum Operating Current: 70 mA
Operating Temperature Max: 85 °C
Operating Temperature Min: -40 °C
Maximum Random Access Time: 8|6 ns
