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Type: Mobile LPDDR4 SDRAM
Density: 8 Gbit
Package: 200TFBGA
Mounting: Surface Mount
DRAM Type: Mobile LPDDR4 SDRAM
MSL Level: MSL 3 - 168 hours
Pin Count: 200
Lead Finish: Tin-Silver-Copper
No. of Pins: 200
Organization: 256M x 32
Data Bus Width: 32 Bit
Memory Density: 8 Gbit
Number of Banks: 16
Screening Level: Industrial
Supplier Package: TFBGA
Address Bus Width: 15 Bit
Maximum Clock Rate: 1600 MHz
Product Dimensions: 10 x 14.5 x 0.82 mm
Supply Voltage Nom: 1.8 V
Clock Frequency Max: 1.6 GHz
Max Processing Temp: 260 °C
Number of I/O Lines: 32 Bit
Operating Temperature: -40 to 85 °C
Number of Bits per Word: 32 Bit
Operating Supply Voltage: 3.3 V
Operating Temperature Max: 95 °C
Operating Temperature Min: -40 °C
