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Type: Mobile DDR SDRAM
Density: 512 Mbit
Package: 60TFBGA
Mounting: Surface Mount
DRAM Type: Mobile DDR SDRAM
MSL Level: MSL 3 - 168 hours
Pin Count: 60
Lead Finish: Tin-Silver-Copper
No. of Pins: 60
Organization: 32M x 16
Data Bus Width: 16 Bit
Memory Density: 512 Mbit
Number of Banks: 4
Screening Level: Commercial
Supplier Package: TFBGA
Address Bus Width: 13 Bit
Maximum Clock Rate: 166 MHz
Supply Voltage Nom: 1.8 V
Clock Frequency Max: 166 MHz
Max Processing Temp: 260 °C
Number of I/O Lines: 16 Bit
Operating Temperature: 0 to 70 °C
Number of Bits per Word: 16 Bit
Operating Supply Voltage: 1.8000 V
Maximum Operating Current: 70 mA
Operating Temperature Max: 70 °C
Operating Temperature Min: 0 °C
Maximum Random Access Time: 5.5|8 ns
