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Pitch: 0.635 mm (0.025 in)
Data Rate: 8 Gbps
Application: FA Equipment, Semiconductor
Stack Height: 8 mm, 14 mm, 20 mm
Current Rating: 500 mA
Mounting Angle: Straight
Mounting Style: PCB Mount
Number of Rows: 2 Row
Voltage Rating: 50 VAC
Contact Plating: Gold
Contact Material: Copper Alloy
Housing Material: Liquid Crystal Polymer (LCP)
Maximum Data Rate: 8 Gbps
Termination Style: Solder
Flammability Rating: UL 94 V-0
Number of Positions: 90 Position
Maximum Operating Temperature: + 105 C
Minimum Operating Temperature: - 40 C
