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Substrate specification: 0201 and above
Trimming range: 0.1mΩ-1Ω
Trimming accuracy: 1% and 5%
Kerf width: 20-40μm
Laser source: JPT-IR
Measurement channels: 96/160
Laser Trimmer is mainly used to scan and trim resistors with the short-pulse laser. The laser can “cut out” kerfs of given depth by gasifying the resistive film on the ceramic substrate, altering the length and the cross-sectional area of the resistor and this subsequently changes its resistance value.
