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MC-301N Batch Reflow Oven - Specifications |
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Applicable Solder Types |
Lead-Free or SnPb |
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Heating Method |
IR & Forced Hot Air Convection |
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User Interface |
Android Software Platform |
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Effective Soldering Area |
9.84" x 7.87" (250 x 200 mm) |
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Heating Chamber Size |
13.78" x 9.84" (350 x 250 mm) |
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Temperature Range |
Ambient - 310 °C |
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Temperature Precision |
±2 °C |
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Temperature Control Method |
PID Control; SSR Contactless Switch Circuit |
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Warm-up Time |
approx. 2.5 min. |
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Power |
3.6 KW (avg.); 6.3 KW (max.) |
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Voltage |
220 V, Single Phase, 50/60 Hz |
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Exhaust Requirement |
6.3 L/Min., .22 CFM |
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Exhaust Temperature (approx.) |
90°C |
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Dimensions |
27.2" L x 18.9" W x 11" H |
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Weight |
approx. 88 lbs. (40 Kg) |
