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Density: 32 MB
Package: 48TFBGA
Mounting: Surface Mount
Rad Hard: No
Cell Type: NOR
MSL Level: MSL 3 - 168 hours
Pin Count: 48
Boot Block: Yes
Access Time: 70 ns
ECC Support: No
Lead Finish: Tin-Silver-Copper
No. of Pins: 48
Architecture: Sectored
Interface Type: Parallel
Memory Density: 32 Mbit
OE Access Time: 35 ns
Number of Words: 2 MWords
Program Current: 45 mA
Screening Level: Industrial
Supplier Package: TFBGA
Address Bus Width: 21 Bit
Block Organization: Symmetrical
Maximum Erase Time: 0.05/Chip s
Product Dimensions: 6 x 8 x 0.8 mm
Supply Voltage Max: 3.6 V
Supply Voltage Min: 2.7 V
Supply Voltage Nom: 3.3 V
Max Processing Temp: 260 °C
Programming Voltage: 2.7 to 3.6 V
Operating Temperature: -40 to 85 °C
Location Of Boot Block: Bottom
Number of Bits per Word: 16 Bit
Maximum Programming Time: 0.01/Word ms
Maximum Operating Current: 15 mA
Operating Temperature Max: 85 °C
Operating Temperature Min: -40 °C
Maximum Random Access Time: 70 ns
Simultaneous Read/Write Support: No
Typical Operating Supply Voltage: 3.3000 V
Erase Suspend/Resume Modes Support: Yes
