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Density: 4 Gbit
Package: 63VFBGA
Mounting: Surface Mount
Rad Hard: No
Cell Type: SLC NAND
Pin Count: 63
Boot Block: No
Interfaces: Parallel
Access Time: 45 ns
ECC Support: Yes
Lead Finish: Tin-Silver-Copper
No. of Pins: 63
Architecture: Sectored
Interface Type: Parallel
Memory Density: 4 Gbit
Number of Words: 512 MWords
Program Current: 35 mA
Screening Level: Automotive
Supplier Package: VFBGA
Address Bus Width: 30 Bit
Block Organization: Symmetrical
Maximum Erase Time: 0.003/Block s
Product Dimensions: 9 x 11 x 0.75 mm
Supply Voltage Max: 3.6 V
Supply Voltage Min: 2.7 V
Supply Voltage Nom: 3.3 V
Max Processing Temp: 260 °C
Programming Voltage: 2.7 to 3.6 V
Operating Temperature: -40 to 105 °C
Number of Bits per Word: 8 Bit
Maximum Programming Time: 0.6/Page ms
Maximum Operating Current: 35 mA
Operating Temperature Max: 105 °C
Operating Temperature Min: -40 °C
Simultaneous Read/Write Support: No
Typical Operating Supply Voltage: 3.3000 V
Erase Suspend/Resume Modes Support: No
