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Pitch: 2.54 mm
Features: DIP socket
Case Style: DIP
Row Spacing: 15.24 mm
Unit Weight: 5.449 g
Current Rating: 3 A
Mounting Style: SMD/SMT
Number of Rows: 2 Row
Contact Plating: Tin
Contact Material: Beryllium Copper
Housing Material: Nylon
Termination Style: Solder Pad
Number of Positions: 24 Position
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 55 C
