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Pitch: 1.27 mm (0.05 in)
Data Rate: 28 Gb/s
Stack Height: 9.05 mm
Current Rating: 2.1 A
Mounting Angle: Vertical
Mounting Style: SMD/SMT
Number of Rows: 2 Row
Contact Plating: Gold
Contact Material: Copper
Housing Material: Liquid Crystal Polymer (LCP)
Maximum Data Rate: 28 Gbps
Termination Style: Solder
Flammability Rating: UL 94 V-0
Number of Positions: 26 Position
Insulation Resistance: 5 GOhms
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 55 C
