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Total power: 2800 W (Max)
Power supply: 220V AC 50 Hz
Bottom preheating power
400 W*4= 1600 W (dark infrared emitter)
400 W*6 = 2400 W (high-resolution infrared heating tube optional)
Top preheating power: 120W*6 = 720 W (infrared heating tube, wavelength: about 2-8 μm)
Top heater size range: 20 – 60 mm (X, Y directions adjustable)
Bottom radiation preheater size: 290* 290 mm
Max. circuit board size: 390* 420 mm
Communication: USB (can be connected with PC)
Temperature measuring sensor: Non-contact infrared
Weight: About 90 kg
Overall dimensions: 850 * 720 *730 mm
PL precision placement system
Camera: 36* 12 times amplification; 24V/300mA; horizontal definition 500 lines; PAL format
Prism size: 50 mm* 50 mm
Reworked BGA size: 2x2 mm – 60x60 mm
Camera output signal: Video signal
RPC Reflow Soldering Monitoring Camera
Camera: 36*12 times amplification
Horizontal definition 500 lines; PAL format
LED auxiliary lighting
CONTROL BOX: Multi-functional operation keyboard
Acquisition card: Four-channel analog video input
VIDEO SOFT: Professional video acquisition software
● IR infrared reflow soldering system
The infrared temperature sensor directly detects the surface temperature of the BGA to achieve true closed-loop control, ensuring an accurate temperature process window and uniform heat distribution.
● PL precise alignment system
The high-definition optical chromatic aberration prism alignment system is used to align the solder ball and pad by overlapping; scientific and precise, simple control, and easy to mount and release.
● RPC reflow soldering camera
The melting process of the BGA solder ball can be observed from multiple angles from the lateral bearing, providing critical assistance in capturing accurate and reliable process curves.
● BGASOFT control software
PC is connected to record, control, and analyze the entire process flow, and generate a temperature curve to meet the process requirements of the modern electronics industry.
● CONTROL BOX operation keyboard
Multi-functional operation keyboard makes continuous rework more efficient and simple.
