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Pitch: 0.635 mm (0.025 in)
Data Rate: 112 Gbps
Mounting Angle: Vertical
Number of Rows: 4 Row
Contact Plating: Gold
Contact Material: Copper Alloy
Housing Material: Liquid Crystal Polymer (LCP)
Maximum Data Rate: 112 Gbps
Termination Style: Solder Balls
Number of Positions: 240 Position
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 40 C
